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HSD8

FEATURES

High Tg: ≥190℃(TMA) / ≥200℃ (DMA)

Extreme Low Loss

Excellent thermal resistance, Td≥340℃

Low Z axis CTE

Low water absorption, excellent anti-CAF, high reliability

Compatible with Lead-ree process


APPLICATIONS

Server

Switch

Router

Measuring instrument


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

TG

TMA

≥190

199

DMA

≥200

226

Peel Strength(HVLP3 HOZ)

288,10S

N/mm

≥0.4

0.55

Peel Strength (HTE HOZ)

288,10S

N/mm

20.5

0.61

Thermal stress

288,solder dip

S

>10

180s No delamination

Flexural Strength

Warp

N/m

≥415

455

Fill

≥345

425

Flammability

E 24/125

-

UL94V-0

V-0

Surface Resistivity

After moisture

≥1.0x104

3.72x108

Volume Resistivity

After moisture

MΩ·cm

≥1.0x106

4.93x109

Dielectric Constant

(L2-Glass 1078*2  RC70%)

10GHZ C 24/23/50

-

\

3.12

Loss Tangent

(L2-Glass 1078*2  RC70%)

10GHZ C 24/23/50

-

\

0.0012

Arc Resistance

D 48/50+D 0.5/23

S

≥60

135

Dielectric Breakdown

D 48/50+D 0.5/23

KV

≥40

65

Moisture Absorption

D 24/23

%

≤0.8

0.10

Td

Weight Loss 5%

≥340

385

CTE in XY/Z Axis

Alpha1

TMA

 

ppm/

≤60

38

Alpha2

ppm/

≤300

165

50 - 260°C

%

≤3.0

1.5

T300(Unclad)

TMA

Min

≥30

>120

 

u  Specimen thickness: 0.8mm (1078 L2-Glass)