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H170GR

FEATURES

High Tg: ≥165℃(TMA), Halogen Free

Low DK/DF(Dk ≤3.4 DF≤0.009 @2GHz)

Excellent Thermal Resistance: Td≥360℃

Low Z-axis CTE

Low water absorption, excellent anti-CAF, high reliability

Compatible with lead-free process


APPLICATIONS

Mobile Phone, Computer

Backplane, Card Board

Switch, Servers

Heavy Copper Product

Automobile Electronics


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Tg

TMA

≧165

175

Peel Strength (Hoz)

288℃,10S

N/mm

0.7

1.05

Thermal stress

288℃,solder dip

S

>10

180s No delamination

Flexural Strength

Warp

N/mm2

≧415

550

Fill

≧345

480

Flammability

E 24/125

UL94V-0

V-0

Surface Resistivity

After moisture

≧1.0x104

3.10x109

Volume Resistivity

After moisture

MΩ· cm

≧1.0x106

4.50x1010

Dielectric Constant(RC70%)

2GHZC 24/23/50

\

3.40

Loss Tangent (RC70%)

2GHZC 24/23/50

\

0.009

Arc Resistance

D 48/50+D 0.5/23

S

≧60

130

Dielectric Breakdown

D 48/50+D 0.5/23

kV

≧40

60

Moisture Absorption

D 24/23

%

≦0.8

0.12

Td

Weight Loss 5%

≧340

386

CTE in XY/Z Axis

Alpha 1

TMA

ppm

≦60

37

Alpha 2

ppm

≦300

223

50-260

%

≦3.0

2.2

CTE, X/Y-axis

TMA

ppm

11-13

12

T288(Unclad)

TMA

Min

≧30

>60

 

u  Specification sheet: IPC-4101E/130, is for your reference only

u  Explanation: C: Humidity conditioning

D: Immersion conditioning distilled water.

E: Temperature conditioning